Designed for aerospace primary and secondary structures. Formulated for efficient processing in high volume Automated Fiber Placement (AFP) applications manufacturing.

Park’s E‐752‐LT is a toughened; 350°F (177°C) cure epoxy resin system with 315°F (157°C) wet Tg. The resin system offers a combination of toughness, low moisture uptake and good mechanical properties. E‐752‐LT is formulated to laminate In Autoclave (AC), Out of Autoclave

Data Sheet: USA / Metric

Tg °C (DSC) 200°C

Features & Benefits

  • Toughened epoxy for primary and secondary aerospace structures
  • Specifically designed for efficient AFP processing
  • Controlled flow rheology specifically designed to facilitate a wide range of processing for AC, OOA and Press cures
  • Processes in OOA without the need for extensive bagging and pre‐vacuum procedures
  • Wet DMA Tg of 315°F (157°C)
  • Dry DMA Tg of 428°F (220°C)
  • Capable of low laminate void content < 1%RoHS Compliant

Product Forms

  • Available AFP product forms
    • 0.125”+/‐0.005” (3.18 mm +/‐0.13 mm)
    • 0.250” +/‐0.005”(6.35 mm +/‐0.13 mm)
  • Unidirectional (UD) Tape up to 48”(1.2 m) width
  • Woven fabric prepreg up to 60” (1.5 m) width

Applications / Qualifications

  • Primary and Secondary Aerospace Structures fabricated with AFP processes
  • Wings / Control Surfaces / Airframes
  • Turbofan Engine Components
  • Nacelles/ Fan Reversers
  • Air Ducting ‐ Fairings