E-767
Versatile, low flow, adhesive grade epoxy resin.
Park’s E‐767 when impregnated on fiberglass fabric provides high bond strength at elevated temperatures while maintaining high electrical integrity with typical cure is 45 minutes at 350°F (175°C).
Key Features & Benefits
- High Tensile Shear Strength
- Excellent electrical Properties
- High peel strength
- Good thermal properties
Product Forms
- Typical reinforcements are 1080 and 116 glass cloth Available in solution coated fabrics up to 60 inches wide (1.5 m)
Applications / Qualifications
- The prime application of Park‘s E‐767 Epoxy is in bonding metallic surfaces to base materials for printed circuit boards, comparable to G10. It is also an excellent adhesive for metal to metal bonding such as stainless steel or aluminum to itself. Copper and other metallics may be bonded to epoxy, polyester, Kapton®, Mylar® and other such dielectric systems. In addition to controlled flow, the E‐767 on fiberglass cloth will maintain a specific bond line thickness. Selection of other fabric carriers will enable the user to vary this bond line thickness according to his or her needs. Other applications have included multilayer, heat sink bonding and overlay.