Our Company

Park Aerospace Corp. develops and manufactures advanced composite materials, primary and secondary structures and assemblies and low-volume tooling for the aerospace markets. Park’s aerospace manufacturing and development facility is located in Newton, Kansas.

History

2020

Park introduces E-752-MTS, its next generation 350°F cure epoxy prepreg for primary structures.

1997

Park acquires Dielektra GmbH, in Cologne, Germany, to expand its ability to provide Nelco® PCB materials in Europe.

1993

Park’s Nelco Products, PTE facility doubles its manufacturing capacity providing additional support for higher technology manufacturing.

1992

Park opened Neltec, Inc., an advanced materials manufacturing and R&D facility, in Tempe, AZ. Park acquired Metclad, later renamed to Neltec S.A., in Lannemezan, France to expand the company’s electronics product lines into the RF/Microwave markets.

1988

Park established FiberCote Industries, Inc., which was renamed Nelcote, Inc. in 2006 and Park Advanced Composite Materials, Inc. in 2008. This business unit manufactured advanced composite materials.

1986

Park constructed its Nelco Products, PTE facility in Singapore to further participate in the globalization of the electronic substrates industry into the Asia Pacific.

1984

Park constructed new manufacturing facilities in Fullerton, CA and Skelmersdale, England to service the company’s growing electronic materials customer base and the printed circuit board industry’s higher technology needs. Park acquired it’s Nelco SA facility in France to further service the European continent. Park pioneered the use of vacuum lamination. The Nelco Technology Inc. semi-finished multilayer facility was constructed in Tempe, AZ.

1971

Park’s Stamford, CT operation moved to a larger location in Walden, NY.

1969

Park opened its Nelco UK electronics materials subsidiary in Skelmersdale, England.

1965

Park Electrochemical Corp. opened it’s second subsidiary, Nelco Products, Inc., in Anaheim, CA.

1962

Park believes it invented the first multilayer printed circuit materials system.