The N4000-11 series of laminate and prepreg materials are being introduced to provide printed circuit board fabricators with a next-generation, high-Tg FR-4 product that is designed to meet the difficult performance specifications currently being proposed by a variety of multinational OEM’s. The N4000-11 is designed to provide a conductive anodic filament (“CAF”) resistant, dimensionally stable material with superior thermal performance. With a nominal Tg of 175 oC, these materials are designed for use in a broad-range of printed circuit board applications requiring very low Z-axis expansion, outstanding thermal stability and superior hole-wall integrity. The N4000-11 also features improved process latitude when compared to similar high Tg dielectric materials currently under investigation for their thermal superiority. This material set is recommended for high density designs in the network storage, telecommunications infrastructure, enterprise server, and internet connectivity market segments.

Certain portions of this news release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics industry, Park’s competitive position, the status of Park’s relationship with its customers, economic conditions in international markets, the cost and availability of utilities, and the various factors set forth under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended March 3, 2002.

Park Electrochemical Corp. is a leading global designer and producer of electronic materials used to fabricate complex multilayer printed circuit boards and interconnection systems. Park specializes in advanced materials for high layer count circuit boards and high speed digital broadband telecommunications, internet and networking applications. Park’s electronic materials business operates through fully integrated business units in Asia, Europe and North America. The Company’s manufacturing facilities are located in Singapore, China, Germany, France, England, Connecticut, New York, Arizona and California. Park’s electronic materials business operates under the “Nelco” name.