The N7000-2 V0 series of laminate and prepreg materials are being introduced to provide printed circuit board fabricators a next-generation, high-Tg polyimide package with a UL 94 V-0 designation. The N7000-2 V0 offers enhanced drilling performance, improved cosmetics and improved thermal resistance when compared to other toughened polyimide systems. The superior z-axis expansion properties and wide processing latitude of the N7000-2 V0 provide an excellent material set for applications that include fine geometry multilayer constructions for military and commercial avionics, burn-in boards, down-hole drilling and other applications requiring extreme reliability.

Certain portions of this news release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics industry, Park’s competitive position, the status of Park’s relationship with its customers, economic conditions in international markets, the cost and availability of utilities, and the various factors set forth under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended March 3, 2002.

Park Electrochemical Corp. is a leading global designer and producer of electronic materials used to fabricate complex multilayer printed circuit boards and interconnection systems. Park specializes in advanced materials for high layer count circuit boards and high speed digital broadband telecommunications, internet and networking applications. Park’s electronic materials business operates through fully integrated business units in Asia, Europe and North America. The Company’s manufacturing facilities are located in Singapore, China, Germany, France, Connecticut, New York, Arizona and California. Park’s electronic materials business operates under the “Nelco” name.