Park Electrochemical Corp. Announces Integration of Metclad SA into Neltec, Inc. And Plans to Expand Rf / Microwave Business in North America

LAKE SUCCESS, New York, April 25, 2001…..Park Electrochemical Corp. (NYSE – PKE) announced the integration of its Metclad SA business in Lannemezan, France into its Neltec, Inc. business in Tempe, Arizona and plans for the expansion of its RF/microwave materials business into North America. The Company will install new RF/microwave materials manufacturing equipment at Neltec’s recently expanded production facility in Tempe, Arizona. This installation is expected to be operational in Park’s current fiscal year’s third quarter and will enable this facility to produce materials for the cellular infrastructure, wireless broadband, and digital broadband markets. In addition, the new equipment will be capable of producing very large format RF/microwave materials. As part of the integration, Metclad SA is changing its name to Neltec SA but will continue to manufacture and develop high speed RF/microwave products. The Metclad product line will be integrated into the Neltec global product line of high performance multilayer materials. The Metclad business will report to Robert A. Forcier, President of Neltec, Inc. and Senior Vice President, OEM Marketing and Technology, of Park.

Mr. Forcier said, “We are very excited about adding manufacturing capability for RF/microwave materials in North America and integrating Metclad SA into Neltec, Inc. As wireless and digital broadband technologies proliferate, we see a unique opportunity to provide our customers with new solutions for critical speed and signal integrity requirements. With the addition of the Metclad product line, we will extend our technology solutions to include rapidly growing applications such as Bluetooth, 3G, advanced power amplifiers, embedded antenna designs, optical routers, wide bandwidth infrastructure systems and high speed chip packaging. We are confident that Neltec’s product capabilities in both RF/microwave products and digital broadband products, such as N4000-13, SI™ and N6000, will enhance system performance for our customers’ next generation applications.”

Certain portions of this news release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics industry, Park’s competitive position, the status of Park’s relationship with its customers, economic conditions in international markets, the cost and availability of utilities, and the various factors set forth under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended February 27, 2000.

Park Electrochemical Corp. is a leading global designer and producer of electronic materials used to fabricate complex multilayer printed circuit boards, semiconductor packages and other electronic interconnect systems. Park specializes in advanced materials for high layer count circuit boards and high speed digital broadband telecommunications, internet and networking applications. Park’s electronic materials business operates through fully integrated business units in Asia, Europe and North America. The Company’s major manufacturing facilities are located in Singapore, England, France, Germany, New York, Arizona and California. Park’s electronic materials business operates under the “Nelco” and “Neltec” names.