Park / Nelco Announces New Laser Drillable Prepreg Series

Anaheim, California, August 18, 2000 – Park/Nelco (NYSE-PKE) announced the introduction of the new laser drillable (LD™) prepreg series.

LD™ is a new glass-reinforced prepreg series designed to significantly improve laser drilling productivity and hole quality when compared to standard E-glass reinforcements. The LD™ products provide improved dimensional stability in blind and buried via products where registration is critical for HDI requirements as compared to resin-coated copper foil. The LD™ series is designed for compatibility with standard FR-4 PCB fabrication processes and is currently available for sampling worldwide.

Park Electrochemical Corp. (NYSE-PKE) is a leading designer and producer of advanced electronic materials used to fabricate complex multilayer printed circuit boards and interconnection systems. Park’s electronic materials business is operated by its “Nelco” group of companies. With 8 fully integrated production facilities in the United States, Europe and Southeast Asia, Park’s Nelco group of companies produce prepreg, laminates, ultra thin materials, continuous lamination, mass lamination and semi-finished multilayers for the global printed circuit board and electronic interconnect markets. Park also manufactures specialty adhesive tapes and advanced composite materials for the electronics, aerospace and industrial markets.

For additional information contact (714) 634-3665 in the United States, see us on the World Wide Web at www.parkelectro.com or visit us at EPC booth W503.