The EF series is designed to bridge the gap between high performance, standard processing and today’s concerns about bromine in the environment. Products are designed to meet or exceed UL 94V-0 requirements. In addition, at least one of the new products will be compatible with the higher soldering temperatures of most lead-free solutions.

Starting with N4000-2 EF, Park/Nelco will continue enhancing the current product line with EF® versions of other popular products such as N4000-6 EF, N4000-13 EF and Resin Coated Copper EF.

Park Electrochemical Corp. (NYSE-PKE) is a leading designer and producer of advanced electronic materials used to fabricate complex multilayer printed circuit boards and interconnection systems. Park’s electronic materials business is operated by its “Nelco” group of companies. With 8 fully integrated production facilities in the United States, Europe and Southeast Asia, Park’s Nelco group of companies produce prepreg, laminates, ultra thin materials, continuous lamination, mass lamination and semi-finished multilayers for the global printed circuit board and electronic interconnect markets. Park also manufactures specialty adhesive tapes and advanced composite materials for the electronics, aerospace and industrial markets. For additional information contact (714) 634-3665 in the United States or see us on the World Wide Web at www.parkelectro.com.