A surfacing film for aircraft composite parts fabrication.

Designed for processing with 250°F (120°C) or 350°F (180°C) cure epoxy prepregs in autoclave and oven applications.

Toughened, low tack epoxy resin system. Self-adhesive prepreg for sandwich applications. Flame retardant. Controlled flow properties and service temperature up to 160°F

Park’s E‐766B is a low tack, Read More→

Aerospace grade epoxy resin system. Wide processing window. Wet service temperature up to 180°F

Park’s E‐765 is a toughened  270°F cure epoxy prepreg system designed to replace 350°F cure systems in many aircraft structural applications.   Read More→

Designed for aerospace primary and secondary structures. Formulated for efficient processing in high volume Automated Fiber Placement (AFP) applications manufacturing.

Park’s E‐752‐LT is a toughened; 350°F (177°C) cure epoxy resin system with 315°F (157°C) wet Tg. Read More→